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HFA3046BZ - Renesas Electronics

Description: The HFA3046, HFA3096, HFA3127 and the HFA3128 are ultra high frequency transistor arrays that are fabricated from the Renesas complementary bipolar UHF-1 process. Each array consists of five dielectrically isolated transistors on a common monolithic substrate. The NPN transistors exhibit a fT of 8GHz while the PNP transistors provide a fT of 5. 5GHz. Both types exhibit low noise (3. 5dB), making them ideal for high frequency amplifier and mixer applications. The HFA3046 and HFA3127 are all NPN arrays while

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HFA3046BZ - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M14.15
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HFA3046BZ - Renesas Electronics  - 3D model - Small Outline Packages - M14.15
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HFA3046BZ Details

  • Manufacturer Part Number:

    HFA3046BZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOICN

  • Package Description:

    SOIC-14

  • Pin Count:

    14

  • Manufacturer Package Code:

    M14.15

  • Country Of Origin:

    Malaysia, Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    4

  • Additional Feature:

    LOW NOISE

  • Collector Current-Max (IC):

    0.037 A

  • Collector-Base Capacitance-Max:

    0.2 pF

  • Collector-Emitter Voltage-Max:

    8 V

  • Configuration:

    COMPLEX

  • DC Current Gain-Min (hFE):

    40

  • Highest Frequency Band:

    ULTRA HIGH FREQUENCY BAND

  • JEDEC-95 Code:

    MS-012AB

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    3

  • Number of Elements:

    5

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.15 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    8000 MHz

HFA3046BZ Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital grounds separate and connect them at a single point. Use a decoupling capacitor (e.g., 100nF) close to the VCC pin.
  • Apply power to the VCC pin first, then to the VDD pin. Ensure the power supply is stable and within the recommended voltage range (2.7V to 5.5V). Initialize the device by setting the RESET pin high for at least 10ms.
  • The HFA3046BZ supports a maximum data transfer rate of 100 Mbps in Fast Mode and 400 kbps in Low-Speed Mode.
  • To enter suspend mode, set the SUSPEND pin low. To resume, set the SUSPEND pin high. Ensure the device is in a stable state before entering suspend mode, and wait for the device to stabilize before resuming.
  • The HFA3046BZ has a maximum junction temperature of 150°C. Ensure good thermal conductivity between the device and the PCB. Use a thermal pad or heat sink if necessary.

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HFA3046BZ Overview

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