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HFA3096BZ96 - Renesas Electronics

Description: The HFA3046, HFA3096, HFA3127 and the HFA3128 are ultra high frequency transistor arrays that are fabricated from the Renesas complementary bipolar UHF-1 process. Each array consists of five dielectrically isolated transistors on a common monolithic substrate. The NPN transistors exhibit a fT of 8GHz while the PNP transistors provide a fT of 5. 5GHz. Both types exhibit low noise (3. 5dB), making them ideal for high frequency amplifier and mixer applications. The HFA3046 and HFA3127 are all NPN arrays while

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PCB Footprints
HFA3096BZ96 - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M16.15
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HFA3096BZ96 - Renesas Electronics  - 3D model - Small Outline Packages - M16.15
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HFA3096BZ96 Details

  • Manufacturer Part Number:

    HFA3096BZ96

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOICN

  • Package Description:

    SOIC-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    M16.15

  • Country Of Origin:

    Mainland China, Malaysia, Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    4

  • Additional Feature:

    LOW NOISE

  • Collector Current-Max (IC):

    0.037 A

  • Collector-Base Capacitance-Max:

    0.2 pF

  • Collector-Emitter Voltage-Max:

    8 V

  • Configuration:

    SEPARATE, 5 ELEMENTS

  • DC Current Gain-Min (hFE):

    40

  • Highest Frequency Band:

    ULTRA HIGH FREQUENCY BAND

  • JEDEC-95 Code:

    MS-012AC

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    3

  • Number of Elements:

    5

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN AND PNP

  • Power Dissipation-Max (Abs):

    0.15 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    8000 MHz

HFA3096BZ96 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to ensure efficient heat dissipation.
  • Ensure that the device is operated within the recommended voltage and current limits, and that the PCB is designed to minimize thermal gradients. Additionally, consider using thermal simulation tools to optimize the design.
  • The device's high current consumption may require a more robust power supply design, including a larger capacitor and a more efficient voltage regulator. Ensure that the power supply can handle the peak current requirements.
  • Use a multi-layer PCB with a solid ground plane, and ensure that the device is placed away from noise-sensitive components. Additionally, use shielding and filtering techniques to minimize EMI.
  • The device is designed to meet the reliability requirements of automotive and industrial applications. The lifespan expectation is typically 10-15 years, depending on the operating conditions and usage.

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HFA3096BZ96 Overview

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