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HFD4/5 - Hongfa

Description: Signal Relay 5VDC 2A DPDT(10x6.5x5.4)mm THT

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PCB Footprints
HFD4/5 - Hongfa PCB footprint - Other - Other - HFD4/5-3
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3D Models
HFD4/5 - Hongfa  - 3D model - Other - HFD4/5-3
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HFD4/5 Details

  • Manufacturer Part Number:

    HFD4/5

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.49.00.50

  • Manufacturer:

    Xiamen Hongfa Electroacoustic Co.,Ltd.

  • YTEOL:

    7.87

  • Body Breadth:

    6.5 mm

  • Body Height:

    5.4 mm

  • Body Length or Diameter:

    10 mm

  • Coil Current(DC)-Max:

    0.028 A

  • Coil Operate Voltage(DC):

    3.75 V

  • Coil Power:

    140 mW

  • Coil Release Voltage(DC):

    0.5 V

  • Coil Resistance:

    178 Ω

  • Coil Voltage(DC)-Max:

    5 V

  • Coil/Input Supply Type:

    DC

  • Contact (AC) Max Rating R Load:

    2A@250VAC

  • Contact Current(AC)-Max:

    2 A

  • Contact Current(DC)-Max:

    2 A

  • Contact (DC) Max Rating R Load:

    2A@220VDC

  • Contact Voltage(AC)-Max:

    250 V

  • Contact Voltage(DC)-Max:

    220 V

  • Contact/Output Supply Type:

    AC/DC

  • Electrical Life:

    100000 Cycle(s)

  • JESD-609 Code:

    e4

  • Mounting Feature:

    THROUGH HOLE-STRAIGHT

  • Operate Time:

    3 ms

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Packing Method:

    TUBE

  • Physical Dimension:

    10mm x 6.5mm x 5.4mm

  • Reference Standard:

    CQC; CUL; TUV; UL

  • Relay Action:

    MOMENTARY

  • Relay Function:

    DPDT

  • Relay Type:

    POWER/SIGNAL RELAY

  • Release Time:

    3 ms

  • Sealing:

    MOISTURE PROOF

  • Surface Mount:

    NO

  • Terminal Finish:

    GOLD

  • Termination Type:

    SOLDER

HFD4/5 Frequently Asked Questions (FAQs)

  • For optimal performance, it's recommended to follow a star-grounding scheme, keep the HFD4/5 away from high-current carrying traces, and place decoupling capacitors close to the device. A 4-layer PCB with a solid ground plane is also recommended.
  • To ensure reliable operation in high-humidity environments, apply a conformal coating to the PCB, use a moisture-resistant PCB material, and consider adding a humidity sensor to monitor the environment. Additionally, ensure the device is properly sealed and follow the manufacturer's storage and handling guidelines.
  • Thermal management is crucial for the HFD4/5. Ensure good airflow around the device, use a heat sink if necessary, and avoid blocking the airflow vents. The device's thermal pad should be connected to a solid ground plane to dissipate heat efficiently.
  • To troubleshoot issues with the HFD4/5, start by checking the power supply voltage and ensuring it's within the recommended range. Verify the PCB layout and component placement, and check for any signs of physical damage or overheating. Use an oscilloscope to analyze the output signal and identify any anomalies.
  • Yes, the HFD4/5 is susceptible to EMI/EMC interference. Ensure the PCB is designed with EMI/EMC in mind, use shielding and filtering where necessary, and follow the manufacturer's guidelines for EMI/EMC compliance.

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HFD4/5 Overview

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