HHM1902B1 - TDK

HHM1902B1 Frequently Asked Questions (FAQs)

• What is the recommended land pattern for the HHM1902B1?
  The recommended land pattern for the HHM1902B1 can be found in the TDK Corporation's application note or on their website. It typically includes a rectangular pad with a size of 1.9mm x 1.2mm and a solder mask opening of 2.2mm x 1.5mm.
• How do I handle the HHM1902B1 during assembly to prevent damage?
  To prevent damage, handle the HHM1902B1 by the edges, avoid touching the pins or the component body, and use an anti-static wrist strap or mat. Also, ensure the assembly area is clean and free from debris.
• What is the maximum reflow temperature for the HHM1902B1?
  The maximum reflow temperature for the HHM1902B1 is 260°C, with a peak temperature of 240°C for a maximum of 20 seconds. Exceeding this temperature may damage the component.
• Can I use the HHM1902B1 in a high-vibration environment?
  Yes, the HHM1902B1 is designed to withstand vibrations up to 10G (rms) in the frequency range of 10-2000 Hz. However, it's recommended to consult with TDK Corporation or a qualified engineer to ensure the component meets the specific vibration requirements of your application.
• How do I store the HHM1902B1 to maintain its shelf life?
  Store the HHM1902B1 in its original packaging, in a dry, cool place, away from direct sunlight and moisture. The recommended storage temperature is between -10°C to 30°C, and the relative humidity should be below 60%.