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HI1-0508-2 - Renesas Electronics

Description: The HI-506/HI-507 and HI-508/HI-509 monolithic CMOS multiplexers each include an array of sixteen and eight analog switches respectively, a digital decoder circuit for channel selection, voltage reference for logic thresholds, and an enable input for device selection when several multiplexers are present. The Dielectric Isolation (DI) process used in fabrication of these devices eliminates the problem of latchup. DI also offers much lower substrate leakage and parasitic capacitance than conventional junctio

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HI1-0508-2 - Renesas Electronics PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - F16.3
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HI1-0508-2 - Renesas Electronics  - 3D model - Ceramic Dual-In-Line Packages - F16.3
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HI1-0508-2 Details

  • Manufacturer Part Number:

    HI1-0508-2

  • Brand Name:

    Renesas

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    CERDIP

  • Package Description:

    DIP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    F16.3

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    4

  • Analog IC - Other Type:

    SINGLE-ENDED MULTIPLEXER

  • JESD-30 Code:

    R-GDIP-T16

  • JESD-609 Code:

    e0

  • Length:

    19.3 mm

  • Neg Supply Voltage-Min (Vsup):

    -10 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Normal Position:

    NO

  • Number of Channels:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Off-state Isolation-Nom:

    68 dB

  • On-state Resistance Match-Nom:

    9 Ω

  • On-state Resistance-Max (Ron):

    300 Ω

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    CERAMIC, GLASS-SEALED

  • Package Code:

    DIP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    5.08 mm

  • Supply Voltage-Min (Vsup):

    10 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    NO

  • Switch-off Time-Max:

    500 ns

  • Switch-on Time-Max:

    500 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

HI1-0508-2 Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for HI1-0508-2 is -40°C to 125°C.
  • To ensure reliable communication, make sure to follow the recommended PCB layout guidelines, use a common ground plane, and implement proper signal termination and filtering.
  • The HI1-0508-2 supports a maximum data transfer rate of 100 Mbps.
  • Yes, the HI1-0508-2 is designed to operate in high-vibration environments, but it's recommended to follow proper mounting and soldering techniques to ensure reliability.
  • To minimize EMI, use proper shielding, grounding, and filtering techniques, and ensure that the HI1-0508-2 is placed away from high-frequency sources.

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HI1-0508-2 Overview

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