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HI1-0546-2 - Renesas Electronics

Description: The HI-546, HI-547, HI-548 and HI-549 are analog multiplexers with active overvoltage protection and guaranteed rON matching. Analog input levels may greatly exceed either power supply without damaging the device or disturbing the signal path of other channels. Active protection circuitry assures that signal fidelity is maintained even under fault conditions that would destroy other multiplexers. Analog inputs can withstand constant 70VP-P levels with ±15V supplies. Digital inputs will also sustain continuo

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HI1-0546-2 - Renesas Electronics PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - F28.6
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HI1-0546-2 Details

  • Manufacturer Part Number:

    HI1-0546-2

  • Brand Name:

    Renesas

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    CERDIP

  • Package Description:

    DIP-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    F28.6

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    4

  • Additional Feature:

    OVERVOLTAGE PROTECTION

  • Analog IC - Other Type:

    SINGLE-ENDED MULTIPLEXER

  • JESD-30 Code:

    R-GDIP-T28

  • JESD-609 Code:

    e0

  • Length:

    36.8 mm

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Normal Position:

    NO

  • Number of Channels:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Off-state Isolation-Nom:

    68 dB

  • On-state Resistance Match-Nom:

    105 Ω

  • On-state Resistance-Max (Ron):

    1500 Ω

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    CERAMIC, GLASS-SEALED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP28,.6

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • Screening Level:

    MIL-STD-883

  • Seated Height-Max:

    5.92 mm

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    NO

  • Switch-off Time-Max:

    500 ns

  • Switch-on Time-Max:

    500 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    15.24 mm

HI1-0546-2 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern around the device.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid hot spots.
  • Use 10uF and 100nF capacitors in parallel, placed as close to the device as possible. Ensure the capacitors are rated for the operating voltage and temperature range.
  • Implement ESD protection diodes (e.g., 1.5KE6.8A) between the power supply lines and ground. Ensure the diodes are rated for the operating voltage and ESD protection level required.
  • Power up the device in the following sequence: VCC, then VDD, and finally the input signals. Ensure a monotonic power-up sequence to prevent latch-up.

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HI1-0546-2 Overview

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Part Image HI1-546/883 Harris Semiconductor

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Part Image HI1-0546-5 Intersil Corporation

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Part Image 5962D9569301VXA Intersil Corporation

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For a full list of alternate parts for HI1-0546-2, check out Findchips.com