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HI3-5043-5Z - Renesas Electronics

Description: This family of CMOS analog switches offers low resistance switching performance for analog voltages up to the supply rails and for signal currents up to 80mA. ON resistance is low and stays reasonably constant over the full range of operating signal voltage and current. rON remains exceptionally constant for input voltages between +5V and -5V and currents up to 50mA. Switch impedance also changes very little over temperature, particularly between 0°C and 75°C. rON is nominally 25Ω for HI-5049 and HI-5051 an

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HI3-5043-5Z - Renesas Electronics PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - f16.3
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HI3-5043-5Z - Renesas Electronics  - 3D model - Dual-In-Line Packages - f16.3
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HI3-5043-5Z Details

  • Manufacturer Part Number:

    HI3-5043-5Z

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    PDIP

  • Package Description:

    PDIP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    E16.3

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Analog IC - Other Type:

    SPDT

  • JESD-30 Code:

    R-PDIP-T16

  • JESD-609 Code:

    e3

  • Length:

    19.17 mm

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Channels:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    16

  • Off-state Isolation-Nom:

    80 dB

  • On-state Resistance Match-Nom:

    2 Ω

  • On-state Resistance-Max (Ron):

    150 Ω

  • Operating Temperature-Max:

    75 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP16,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    5.33 mm

  • Signal Current-Max:

    0.03 A

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    NO

  • Switch-off Time-Max:

    500 ns

  • Switch-on Time-Max:

    500 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL EXTENDED

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

HI3-5043-5Z Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout and thermal management guide in their application notes (e.g., AN1841) and design guides (e.g., DG-00234). It's essential to follow these guidelines to ensure optimal performance, reduce thermal issues, and prevent damage to the device.
  • Renesas recommends a specific power-up and power-down sequencing to prevent damage to the device. This information can be found in the datasheet, but it's often overlooked. The recommended sequence is: VCC, then VDD, then VEE, and finally the input signals. For power-down, the sequence should be reversed.
  • While the HI3-5043-5Z is suitable for high-frequency applications, there are limitations and considerations that need to be taken into account. For example, the device's bandwidth, slew rate, and settling time should be carefully evaluated. Additionally, PCB layout, component selection, and signal integrity become critical at high frequencies. Renesas provides guidance on these topics in their application notes and design guides.
  • Renesas provides guidelines for EMC and EMI compliance in their application notes and design guides. It's essential to follow these guidelines, which include proper PCB layout, component selection, and shielding. Additionally, the device's operating frequency, signal integrity, and power supply noise should be carefully managed to minimize EMI and ensure EMC compliance.
  • Renesas provides reliability and quality metrics for the HI3-5043-5Z, including MTBF (mean time between failures), FIT (failures in time), and other relevant data. These metrics should be carefully evaluated to ensure the device meets the system's reliability and quality requirements. The system design should also take into account the device's operating conditions, power supply, and thermal management to minimize the risk of failure.

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HI3-5043-5Z Overview

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