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HI5860IBZ - Renesas Electronics

Description: The HI5860 is a 12-bit, 130MSPS (Mega Samples Per Second), High-Speed, low power, D/A converter which is implemented in an advanced CMOS process. Operating from a single +3V to +5V supply, the converter provides 20mA of full scale output current and includes edge-triggered CMOS input data latches. Low glitch energy and excellent frequency domain performance are achieved using a segmented current source architecture. This device complements the HI5x60 and HI5x28 family of High-Speed converters, which include

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HI5860IBZ - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M28.3-28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
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HI5860IBZ - Renesas Electronics  - 3D model - Small Outline Packages - M28.3-28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
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HI5860IBZ Details

  • Manufacturer Part Number:

    HI5860IBZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOICW

  • Pin Count:

    28

  • Manufacturer Package Code:

    M28.3

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.40

  • Factory Lead Time:

    4 Weeks

  • Date Of Intro:

    2017-10-26

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Analog Output Voltage-Max:

    1.25 V

  • Analog Output Voltage-Min:

    -0.3 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    PARALLEL, WORD

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    17.9 mm

  • Linearity Error-Max (EL):

    0.04882%

  • Moisture Sensitivity Level:

    3

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP28,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2.65 mm

  • Settling Time-Nom (tstl):

    0.035 µs

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

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HI5860IBZ Overview

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