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HIP2101IBZT7A - Renesas Electronics

Description: The HIP2101 is a high frequency, 100V Half Bridge N-Channel power MOSFET driver IC. It is equivalent to the HIP2100 with the added advantage of full TTL/CMOS compatible logic input pins. The low-side and high-side gate drivers are independently controlled and matched to 13ns. This gives users total control over dead time for specific power circuit topologies. Undervoltage protection on both the low-side and high-side supplies force the outputs low. An on-chip diode eliminates the discrete diode required wit

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HIP2101IBZT7A - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - SOIC--8
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HIP2101IBZT7A Details

  • Manufacturer Part Number:

    HIP2101IBZT7A

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOICN

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    M8.15

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2019-08-08

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • High Side Driver:

    YES

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    HALF BRIDGE BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    PUSH-PULL

  • Output Peak Current Limit-Nom:

    2 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    3.4 mA

  • Supply Voltage-Max:

    14 V

  • Supply Voltage-Min:

    9 V

  • Supply Voltage-Nom:

    12 V

  • Supply Voltage1-Max:

    119 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    12 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.056 µs

  • Turn-on Time:

    0.056 µs

  • Width:

    3.9 mm

HIP2101IBZT7A Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The HIP2101IBZT7A package has an exposed thermal pad, which should be connected to the ground plane using multiple thermal vias to ensure good heat dissipation.
  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Implement proper thermal management, such as heat sinks or fans, to keep the device temperature within the recommended range.
  • The critical timing parameters include the input rise and fall times, output rise and fall times, and the propagation delay. These parameters are critical for ensuring reliable operation and should be carefully considered during design.
  • Implement ESD protection measures, such as TVS diodes or ESD protection arrays, on the input and output pins to prevent damage from electrostatic discharge. Follow the recommended PCB layout and handling procedures to minimize the risk of ESD damage.
  • The recommended power-up sequence is to apply the input voltage (VIN) before the enable signal (EN). During power-down, the enable signal should be turned off before the input voltage is removed. This ensures that the device is properly shut down and minimizes the risk of damage.

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