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HIP2211FR8Z-T - Renesas Electronics

Description: The HIP2211 is a 100V, 3A source, 4A sink high-frequency half-bridge NMOS FET driver. The HIP2211 features standard HI/LI inputs and is pin-compatible with popular Renesas bridge drivers such as the HIP2101 and ISL2111. Its wide operating supply range of 6V to 18V and integrated high-side bootstrap diode supports driving the high-side and low-side NMOS in 100V half-bridge applications.This driver features a strong 3A source, 4A sink driver with very fast 15ns typical propagation delay and 2ns typical delay

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HIP2211FR8Z-T - Renesas Electronics PCB footprint - Small Outline No-lead - Small Outline No-lead - L8.4x4-
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HIP2211FR8Z-T - Renesas Electronics  - 3D model - Small Outline No-lead - L8.4x4-
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HIP2211FR8Z-T Details

  • Manufacturer Part Number:

    HIP2211FR8Z-T

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Pin Count:

    8

  • Manufacturer Package Code:

    L8.4X4

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Date Of Intro:

    2020-06-23

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    8

  • High Side Driver:

    YES

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    HALF BRIDGE BASED MOSFET DRIVER

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    STANDARD

  • Output Peak Current Limit-Nom:

    4 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.16,32

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    2.32 mA

  • Supply Voltage-Max:

    18 V

  • Supply Voltage-Min:

    6 V

  • Supply Voltage-Nom:

    12 V

  • Supply Voltage1-Max:

    115 V

  • Supply Voltage1-Nom:

    12 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.03 µs

  • Turn-on Time:

    0.03 µs

  • Width:

    4 mm

HIP2211FR8Z-T Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout in the HIP2211 application note (R16AN0244) which includes guidelines for thermal vias, copper pours, and component placement to minimize thermal resistance and ensure reliable operation.
  • The HIP2211 requires a specific startup sequence to ensure proper biasing. Renesas recommends following the startup sequence outlined in the datasheet, which includes applying VCC before VIN, and ensuring that VCC is stable before enabling the device.
  • The maximum allowed voltage on the VIN pin during startup is 5V. Exceeding this voltage can damage the device. It's essential to ensure that the VIN pin is not exposed to voltages above 5V during startup or operation.
  • The HIP2211 has built-in OCP and OVP features. To handle these events, designers should implement external circuitry to detect and respond to OCP and OVP flags. Renesas provides guidance on implementing OCP and OVP in the application note (R16AN0244).
  • Renesas recommends implementing ESD protection on the VIN and VOUT pins using TVS diodes or other ESD protection devices. The application note (R16AN0244) provides guidance on selecting and implementing ESD protection components.

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