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HMC0603JT100M - Stackpole Electronics, Inc.

Description: RES, 0603, 100 Mohm, 5%, 0.1W

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HMC0603JT100M Details

  • Manufacturer Part Number:

    HMC0603JT100M

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    SEI Stackpole Electronics Inc

  • YTEOL:

    12

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.45 mm

  • Package Length:

    1.6 mm

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.1 W

  • Rated Temperature:

    70 °C

  • Resistance:

    100000000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0603

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    400 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    5%

  • Working Voltage:

    50 V

HMC0603JT100M Frequently Asked Questions (FAQs)

  • The recommended land pattern for the HMC0603JT100M is a rectangular pad with a size of 1.5mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape.
  • Handle the HMC0603JT100M by the edges or the body, avoiding touching the terminations. Use anti-static wrist straps, mats, or floors to prevent electrostatic discharge (ESD) damage.
  • The maximum storage temperature for the HMC0603JT100M is 40°C (104°F) for a maximum of 12 months.
  • Yes, the HMC0603JT100M is designed to withstand high-vibration environments. However, it's recommended to follow the manufacturer's guidelines for vibration testing and ensure proper mounting and soldering.
  • Use a soldering iron with a temperature of 250°C (482°F) to 270°C (518°F) and a solder with a melting point of 180°C (356°F) to 220°C (428°F). Apply a small amount of solder to the pad, and use a soldering technique that minimizes the risk of overheating the component.

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HMC0603JT100M Overview

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