The recommended land pattern for the HMC0603JT30M0 is a rectangular pad with a size of 0.6mm x 0.3mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
The HMC0603JT30M0 has a maximum operating temperature of 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the component is properly derated and that the application does not exceed the maximum rated temperature.
The HMC0603JT30M0 has a moisture sensitivity level (MSL) of 1, which means it can withstand a maximum of 30 days in a humidity-controlled environment before being soldered.
Yes, the HMC0603JT30M0 is RoHS (Restriction of Hazardous Substances) and REACH (Registration, Evaluation, Authorization, and Restriction of Chemicals) compliant, making it suitable for use in European Union and other regions with similar regulations.
The recommended soldering profile for the HMC0603JT30M0 is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. The soldering process should be done in a nitrogen atmosphere to minimize oxidation.
Trust Checks
No trust score is available for this model.
Trust Score Unavailable
Sponsored
HMC0603JT30M0 Overview
Use the download button to access the HMC0603JT30M0 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like HMC06,
or try a keyword search, such as Fixed Resistors
