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HMC1206JT50M0 - Stackpole Electronics, Inc.

Description: RES, 1206, 50 Mohm, 5%, 0.25W

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PCB Footprints
HMC1206JT50M0 - Stackpole Electronics, Inc. PCB footprint - Resistor Chip - Resistor Chip - HMC1206
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3D Models
HMC1206JT50M0 - Stackpole Electronics, Inc.  - 3D model - Resistor Chip - HMC1206
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HMC1206JT50M0 Details

  • Manufacturer Part Number:

    HMC1206JT50M0

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP, ROHS COMPLIANT

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    SEI Stackpole Electronics Inc

  • YTEOL:

    11

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    3.1 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.55 mm

  • Packing Method:

    TR, PAPER, 7 INCH

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    70 °C

  • Resistance:

    50000000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    400 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    5%

  • Working Voltage:

    200 V

HMC1206JT50M0 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the HMC1206JT50M0 can be found in the Stackpole Electronics Inc. application note AN-040, which provides guidelines for PCB layout and land pattern design.
  • The HMC1206JT50M0 has a high power density, so thermal management is crucial. Use a thermal pad or heat sink to dissipate heat, and ensure good airflow around the component. The datasheet provides thermal resistance values to help with thermal design.
  • The maximum operating temperature range for the HMC1206JT50M0 is -55°C to +150°C, as specified in the datasheet. However, it's recommended to derate the power rating at higher temperatures to ensure reliability.
  • The HMC1206JT50M0 is designed to withstand moderate vibration levels, but it's essential to follow proper mounting and soldering techniques to ensure reliability in high-vibration environments. Consult the datasheet and application notes for guidance.
  • The HMC1206JT50M0 is designed to meet general EMI requirements, but specific applications may have additional requirements. Consult the datasheet and application notes for EMI-related information, and consider using EMI filters or shielding to meet your application's specific needs.

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HMC1206JT50M0 Overview

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