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HMC646LP2E - Analog Devices

Description: 40W SPDT Failsafe Switch SMT, 0.1 - 2.1 GHz

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HMC646LP2E - Analog Devices - PCB symbol
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PCB Footprints
HMC646LP2E - Analog Devices PCB footprint - Small Outline No-lead - Small Outline No-lead - HMC653LP2E
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HMC646LP2E - Analog Devices - 3D model - Small Outline No-lead - HMC653LP2E
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HMC646LP2E Details

  • Manufacturer Part Number:

    HMC646LP2E

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    2 X 2 MM, ROHS COMPLIANT, LEADLESS, PLASTIC, SMT, DFN-6

  • Pin Count:

    6

  • Manufacturer Package Code:

    HCP-6-1

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Characteristic Impedance:

    50 Ω

  • Construction:

    COMPONENT

  • Input Power-Max (CW):

    44 dBm

  • Insertion Loss-Max:

    1.7 dB

  • Isolation-Min:

    12 dB

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • On Time-Nom:

    0.32 µs

  • Operating Frequency-Max:

    2100 MHz

  • Operating Frequency-Min:

    100 MHz

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Equivalence Code:

    SOLCC6,.08,25

  • Port Termination:

    ABSORPTIVE

  • Power Supplies:

    5 V

  • RF/Microwave Device Type:

    SPDT

  • Surface Mount:

    YES

  • Technology:

    GAAS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • VSWR-Max:

    1.09

HMC646LP2E Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure good thermal conductivity by using a thermal pad and connecting it to a heat sink or a metal plate.
  • Use a combination of simulation tools and empirical methods to optimize the biasing and matching networks. Consider using a load-pull analysis to optimize the output matching network.
  • Use a low-noise voltage regulator, decouple the power supply lines, and use a shielded enclosure. Keep the signal lines short and away from the power supply lines. Use a common-mode choke to reduce EMI.
  • Monitor the device's junction temperature, voltage, and current to ensure they are within the specified limits. Use a thermal sensor and a voltage/current monitor to prevent overheating and overvoltage/overcurrent conditions.
  • Use a vector network analyzer (VNA) to measure the device's S-parameters, and a spectrum analyzer to measure the output power and spectral purity. Use a calibrated load to measure the device's output power and efficiency.

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HMC646LP2E Overview

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To find more CAD model downloads similar to this part, try a partial part number search, like HMC64, or try a keyword search, such as RF/Microwave Switches

About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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HMC646LP2E Alternates

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Image Part Number Model
Part Image HMC646LP2 Hittite Microwave Corp

SPDT, 100MHz Min, 2100MHz Max, 1 Func, 1.7dB Insertion Loss-Max, GAAS
Part Image HMC646LP2 Analog Devices Inc

SPDT, 100MHz Min, 2100MHz Max, 1 Func, 1.7dB Insertion Loss-Max, GAAS