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HMC815BLC5 - Analog Devices

Description: Up-Down Converters

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HMC815BLC5 Details

  • Manufacturer Part Number:

    HMC815BLC5

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LCC-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    E-32-1

  • Country Of Origin:

    USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Characteristic Impedance:

    50 Ω

  • Construction:

    COMPONENT

  • IF Frequency-Max:

    3750 MHz

  • Input Power-Min (CW):

    15 dBm

  • JESD-609 Code:

    e4

  • LO Tunable:

    YES

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Max:

    20 dBm

  • Package Body Material:

    CERAMIC

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Power Supplies:

    4.5 V

  • RF Output Frequency-Max:

    27000 MHz

  • RF Output Frequency-Min:

    21000 MHz

  • RF/Microwave Device Type:

    UP CONVERTER

  • Surface Mount:

    YES

  • Technology:

    PHEMT

  • Terminal Finish:

    Gold (Au) - with Nickel (Ni) barrier

  • Up Conversion Gain-Min:

    7 dB

HMC815BLC5 Frequently Asked Questions (FAQs)

  • A good PCB layout for the HMC815BLC5 involves keeping the signal paths short, using a solid ground plane, and minimizing the number of vias. It's also recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane. Additionally, the device should be placed near the edge of the board to minimize the distance to the antenna.
  • To optimize the power supply design for the HMC815BLC5, it's recommended to use a low-noise, low-dropout regulator (LDO) with a high power supply rejection ratio (PSRR). The power supply should be decoupled with a 10uF capacitor in parallel with a 100nF capacitor. Additionally, the power supply lines should be routed away from the RF signal lines to minimize noise coupling.
  • The recommended operating temperature range for the HMC815BLC5 is -40°C to +85°C. However, the device can operate up to +105°C with reduced performance. It's recommended to use a heat sink or a thermal pad to dissipate heat and ensure reliable operation.
  • To troubleshoot common issues with the HMC815BLC5, it's recommended to check the power supply voltage, the input signal level, and the PCB layout. Ensure that the device is properly biased and that the input signal is within the recommended range. Use a spectrum analyzer to measure the output signal and identify any spurious signals or harmonics. Additionally, check the device's temperature and ensure that it's within the recommended operating range.
  • Yes, the HMC815BLC5 can be used in a push-pull configuration to increase the output power. However, this requires careful design and layout to ensure that the two devices are properly synchronized and that the output signals are properly combined. It's recommended to use a balun or a transformer to combine the output signals and to ensure that the output impedance is properly matched.

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HMC815BLC5 Overview

Use the download button to access the HMC815BLC5 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like HMC81, or try a keyword search, such as RF/Microwave Up/Down Converters

About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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