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HMC8200LP5ME - Analog Devices

Description: RF Transmitter IC 0.8-4GHz QAM LFCSP-32

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PCB Footprints
HMC8200LP5ME - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 32-Lead LFCSP,
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3D Models
HMC8200LP5ME - Analog Devices  - 3D model - Quad Flat No-Lead - 32-Lead LFCSP,
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HMC8200LP5ME Details

  • Manufacturer Part Number:

    HMC8200LP5ME

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LFCSP-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    CP-32-27

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    5A991.B

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • JESD-30 Code:

    S-XQCC-N32

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    TELECOM CIRCUIT

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    5 mm

HMC8200LP5ME Frequently Asked Questions (FAQs)

  • Analog Devices provides a recommended PCB layout and thermal management guidelines in their application notes and evaluation board documentation. It's essential to follow these guidelines to ensure optimal performance, especially for high-frequency and high-power applications.
  • Analog Devices provides a range of evaluation boards and software tools to help optimize the HMC8200LP5ME for specific frequency bands. Engineers can use these resources to fine-tune the device's performance and achieve optimal results.
  • Common sources of noise and interference in the HMC8200LP5ME include thermal noise, shot noise, and electromagnetic interference (EMI). To mitigate these effects, engineers can use techniques such as shielding, filtering, and grounding, as well as optimizing the device's operating conditions and PCB layout.
  • To ensure the reliability and longevity of the HMC8200LP5ME, engineers should follow proper handling and storage procedures, operate the device within its recommended specifications, and implement adequate thermal management and ESD protection. Additionally, Analog Devices provides reliability data and guidelines in their documentation.
  • The HMC8200LP5ME offers various operating modes and configurations that trade off performance, power consumption, and noise figure. Engineers should carefully evaluate these trade-offs and choose the optimal configuration for their specific application requirements.

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HMC8200LP5ME Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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