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HMC826LP6CE - Analog Devices

Description: Fractional-N PLL with Integrated VCO SMT, 990 - 1105 MHz

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Symbol
HMC826LP6CE - Analog Devices - PCB symbol
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PCB Footprints
HMC826LP6CE - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - H839
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3D Models
HMC826LP6CE - Analog Devices - 3D model - Quad Flat No-Lead - H839
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HMC826LP6CE Details

  • Manufacturer Part Number:

    HMC826LP6CE

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SMT-40

  • Pin Count:

    40

  • Manufacturer Package Code:

    HCP-40-1

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    0

  • Additional Feature:

    IT ALSO OPERATES WITH 4.8V-5.2V SUPPLY

  • Analog IC - Other Type:

    PHASE LOCKED LOOP

  • JESD-30 Code:

    S-PQCC-N40

  • JESD-609 Code:

    e3

  • Length:

    6 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    40

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC40,.24SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Max (Vsup):

    3.5 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    6 mm

HMC826LP6CE Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. The device should be placed near the center of the board, and the RF traces should be kept short and shielded to minimize radiation and coupling.
  • The biasing of the device should be optimized for the specific application. A good starting point is to set the VDD to 5V and the VBIAS to 2.5V. The bias current should be set to around 100mA. The optimal biasing can be determined by measuring the device's performance and adjusting the biasing accordingly.
  • The maximum operating temperature of the HMC826LP6CE is 85°C. However, the device's performance may degrade at higher temperatures, and it is recommended to operate it at a temperature below 70°C for optimal performance.
  • To ensure the reliability and longevity of the HMC826LP6CE, it is recommended to follow proper handling and storage procedures, operate the device within its recommended specifications, and provide adequate heat sinking and power supply decoupling. Additionally, it is recommended to follow a robust design and testing process to ensure the device is operating within its specifications.
  • The HMC826LP6CE has built-in ESD protection, but it is still recommended to follow proper ESD handling and storage procedures to prevent damage to the device. The device should be handled in an ESD-controlled environment, and ESD-sensitive devices should be grounded before handling.

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HMC826LP6CE Overview

Use the download button to access the HMC826LP6CE schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like HMC82, or try a keyword search, such as PLL or Frequency Synthesis Circuits

About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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