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HMC829LP6GETR - Analog Devices

Description: Fractional-N PLL with Integrated VCO45 - 1050, 1400 - 2100, 2800 - 4200 MHz

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HMC829LP6GETR - Analog Devices - PCB symbol
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PCB Footprints
HMC829LP6GETR - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - LFCSP:LEADFRM CHIP SCALE_2023
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3D Models
HMC829LP6GETR - Analog Devices - 3D model - Quad Flat No-Lead - LFCSP:LEADFRM CHIP SCALE_2023
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HMC829LP6GETR Details

  • Manufacturer Part Number:

    HMC829LP6GETR

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    ROHS COMPLIANT, PLASTIC, QFN-40

  • Pin Count:

    40

  • Manufacturer Package Code:

    HCP-40-1

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    0

  • JESD-30 Code:

    S-PQCC-N40

  • Length:

    6 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    40

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    RF AND BASEBAND CIRCUIT

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6 mm

HMC829LP6GETR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure good thermal conductivity by using a thermal pad and a heat sink if necessary.
  • Use a network analyzer to measure the input and output impedance of the device, and then design the matching networks using a Smith chart or a circuit simulator like ADS or AWR.
  • Derate the voltage by 10-15% and the current by 20-25% to ensure reliable operation over the entire operating temperature range.
  • Use a stability analysis tool like the Nyquist plot or the Bode plot to identify potential instability issues, and add resistive or capacitive loading to the output stage if necessary.
  • Handle the device with an ESD wrist strap or mat, and ensure that the PCB is designed with ESD protection diodes and resistors to prevent damage during assembly and testing.

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HMC829LP6GETR Overview

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To find more CAD model downloads similar to this part, try a partial part number search, like HMC82, or try a keyword search, such as Cellular Telephone Circuits

About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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