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HMC830LP6GE - Analog Devices

Description: Fractional-N PLL with Integrated VCO SMT, 25 - 3000 MHz

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HMC830LP6GE - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - LFCSP:LEADFRM CHIP SCALE_1
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HMC830LP6GE - Analog Devices  - 3D model - Quad Flat No-Lead - LFCSP:LEADFRM CHIP SCALE_1
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HMC830LP6GE Details

  • Manufacturer Part Number:

    HMC830LP6GE

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SMT-40

  • Pin Count:

    40

  • Manufacturer Package Code:

    HCP-40-1

  • Country Of Origin:

    South Korea

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    0

  • JESD-30 Code:

    S-PQCC-N40

  • JESD-609 Code:

    e3

  • Length:

    6 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    40

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    RF AND BASEBAND CIRCUIT

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    6 mm

HMC830LP6GE Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power plane to minimize noise coupling.
  • Ensure the VCC and VEE pins are properly decoupled with 100nF capacitors, and the ISET pin is set to the recommended current (typically 10mA) using a resistor to GND.
  • The maximum power dissipation is 1.5W, so ensure the device is properly heat-sinked and the ambient temperature is within the recommended range (-40°C to 85°C).
  • Use a level translator or a buffer to interface the HMC830LP6GE with a microcontroller, as the device operates at a different voltage level (typically 3.3V or 5V).
  • The HMC830LP6GE is optimized for frequencies between 100MHz to 6GHz, but it can operate up to 10GHz with reduced performance.

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HMC830LP6GE Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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