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HS1-3182-8 - Renesas Electronics

Description: The HS-3182 is a monolithic dielectrically isolated bipolar differential line driver designed to meet the specifications of ARINC 429. This Device is intended to be used with a companion chip, HS-3282 CMOS ARINC Bus Interface Circuit, which provides the data formatting and processor interface function. All logic inputs are TTL and CMOS compatible. In addition to the DATA (A) and DATA (B) inputs, there are also inputs for CLOCK and SYNC signals which are AND'd with the DATA inputs. This feature enhances syst

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HS1-3182-8 - Renesas Electronics PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - (SBDIP)-D16.3 MIL-STD-1835 CDIP2-T16 (D-2, CONFIGURATION C) 16 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACK
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3D Models
HS1-3182-8 - Renesas Electronics  - 3D model - Dual-In-Line Packages - (SBDIP)-D16.3 MIL-STD-1835 CDIP2-T16 (D-2, CONFIGURATION C) 16 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACK
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HS1-3182-8 Details

  • Manufacturer Part Number:

    HS1-3182-8

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SBDIP

  • Pin Count:

    16

  • Manufacturer Package Code:

    D16.3

  • Country Of Origin:

    Philippines, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    5.68

  • Differential Output:

    NO

  • Driver Number of Bits:

    2

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LINE DRIVER

  • Interface Standard:

    ARINC 429

  • JESD-30 Code:

    R-CDIP-T16

  • JESD-609 Code:

    e4

  • Length:

    21.34 mm

  • Number of Functions:

    2

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    CERAMIC, METAL-SEALED COFIRED

  • Package Code:

    DIP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    3300 ns

  • Seated Height-Max:

    5.08 mm

  • Supply Voltage-Max:

    5.25 V

  • Supply Voltage-Min:

    4.75 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    16.5 V

  • Supply Voltage1-Min:

    13.5 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    NO

  • Technology:

    BIPOLAR

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    GOLD

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Transmit Delay-Max:

    3300 ns

  • Width:

    7.62 mm

HS1-3182-8 Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for HS1-3182-8 is -40°C to 125°C.
  • To ensure reliable operation in high-temperature environments, it is recommended to use a heat sink and ensure good thermal conductivity between the device and the heat sink. Additionally, reducing the power consumption and using a thermal interface material can help to reduce the junction temperature.
  • The maximum allowable power dissipation for HS1-3182-8 is 1.5W. Exceeding this limit can cause the device to overheat and potentially fail.
  • To handle ESD protection for HS1-3182-8, it is recommended to use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins. Additionally, following proper handling and storage procedures can help to prevent ESD damage.
  • The recommended storage temperature range for HS1-3182-8 is -40°C to 150°C.

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HS1-3182-8 Overview

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