Apex Microtechnology recommends a 4-layer PCB with a solid ground plane, and thermal vias under the device to dissipate heat. A minimum of 1 oz copper thickness is recommended. Additionally, a heat sink or thermal interface material can be used to further improve thermal performance.
To ensure reliable operation at high temperatures, Apex recommends following the derating curves provided in the datasheet, using a heat sink or thermal interface material, and ensuring good airflow around the device. Additionally, the device should be operated within the recommended voltage and current ranges.
Apex recommends using a low-pass filter with a cutoff frequency of 100 kHz or lower on the input and output of the HS14 to reduce noise and ensure stable operation. A ferrite bead or common-mode choke can also be used to further reduce noise and EMI.
Apex recommends using overvoltage protection (OVP) and overcurrent protection (OCP) circuits to prevent damage to the HS14. A voltage clamp or zener diode can be used for OVP, and a current sense resistor or fuse can be used for OCP.
Apex recommends a slow startup sequence to prevent inrush currents and ensure stable operation. The recommended sequence is to first apply the input voltage, then enable the output voltage, and finally apply the load. During shutdown, the load should be disconnected first, followed by the output voltage, and finally the input voltage.
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