Apex Microtechnology recommends a 4-layer PCB with a dedicated ground plane, and thermal vias under the device to ensure efficient heat dissipation. A minimum of 1 oz copper thickness is recommended for the top and bottom layers.
Apex Microtechnology recommends following the recommended PCB mounting and screw torque specifications, and using a conformal coating to protect the device from environmental factors. Additionally, consider using a vibration-dampening material, such as a silicone adhesive, to secure the device to the PCB.
The maximum allowable power dissipation for the HS23 is 15W. However, it's essential to follow the recommended thermal management guidelines to ensure the device operates within its specified temperature range.
Yes, the HS23 is designed to meet the requirements of high-reliability and aerospace applications. However, it's essential to follow Apex Microtechnology's recommended screening and qualification procedures to ensure the device meets the specific requirements of your application.
Apex Microtechnology provides a troubleshooting guide in the HS23 application note, which covers common issues and their solutions. Additionally, engineers can contact Apex Microtechnology's technical support team for assistance with troubleshooting and debugging.
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HS23 Overview
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