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HS8K11TB - ROHM Semiconductor

Description: 30V Nch+Nch Power MOSFET

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Symbol
HS8K11TB - ROHM Semiconductor - PCB symbol
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PCB Footprints
HS8K11TB - ROHM Semiconductor PCB footprint - Other - Other - HSML3030L10_2022
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3D Models
HS8K11TB - ROHM Semiconductor - 3D model - Other - HSML3030L10_2022
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HS8K11TB Details

  • Manufacturer Part Number:

    HS8K11TB

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HALOGEN FREE AND ROHS COMPLIANT, HSML3030L10, 8 PIN

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    21 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    5.4

  • Avalanche Energy Rating (Eas):

    3.6 mJ

  • Case Connection:

    DRAIN SOURCE

  • Configuration:

    COMPLEX

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    7 A

  • Drain-source On Resistance-Max:

    0.0291 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    S-PDSO-N8

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    28 A

  • Surface Mount:

    YES

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

HS8K11TB Frequently Asked Questions (FAQs)

  • ROHM recommends a thermal pad size of at least 2mm x 2mm, with a minimum of 10 thermal vias (0.3mm diameter) connecting to a solid copper plane on the bottom layer. This ensures efficient heat dissipation and reduces thermal resistance.
  • To accommodate the high current handling of the HS8K11TB, use thick copper traces (at least 1oz) and ensure the PCB has a sufficient number of layers to distribute the current. Additionally, consider using a copper pour or a dedicated power plane to reduce resistance and inductance.
  • ROHM recommends a soldering temperature of 260°C (500°F) with a maximum soldering time of 10 seconds. This ensures reliable solder joints and prevents damage to the device.
  • While the HS8K11TB is designed to operate in a wide range of temperatures, it's not recommended for use in high-humidity environments (>80% RH) without proper protection. Consider using a conformal coating or potting compound to prevent moisture ingress and ensure reliable operation.
  • To prevent ESD damage, handle the HS8K11TB with an anti-static wrist strap or mat, and ensure that all equipment and tools are properly grounded. During assembly, use an ESD-protected workstation and follow proper ESD handling procedures.

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HS8K11TB Overview

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