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HSM24B-TP - MCC

Description: ESD Protection Device

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PCB Footprints
HSM24B-TP - MCC PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23-ren20
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3D Models
HSM24B-TP - MCC  - 3D model - SOT23 (3-Pin) - SOT-23-ren20
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HSM24B-TP Details

  • Manufacturer Part Number:

    HSM24B-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOT-23, 3 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    7

  • Breakdown Voltage-Min:

    25 V

  • Clamping Voltage-Max:

    34.5 V

  • Configuration:

    COMMON ANODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-G3

  • Non-rep Peak Rev Power Dis-Max:

    450 W

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity:

    BIDIRECTIONAL

  • Reference Standard:

    IEC-61000-4-2, 4-5

  • Rep Pk Reverse Voltage-Max:

    24 V

  • Reverse Current-Max:

    0.2 µA

  • Reverse Test Voltage:

    24 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

HSM24B-TP Frequently Asked Questions (FAQs)

  • The recommended PCB layout and land pattern for the HSM24B-TP can be found in the Micro Commercial Components' application note AN-115, which provides detailed guidelines for optimal board design and assembly.
  • The HSM24B-TP has a thermal pad on the bottom of the package, which should be connected to a thermal ground plane on the PCB to dissipate heat efficiently. Additionally, ensure good airflow around the device and consider using a heat sink if necessary.
  • The HSM24B-TP is rated for operation from -40°C to +125°C, but it's essential to note that the device's performance and reliability may degrade at extreme temperatures. Consult the datasheet for specific temperature-related specifications.
  • The HSM24B-TP is designed to withstand moderate vibration levels, but it's crucial to ensure that the PCB is properly secured and the device is adequately soldered to prevent mechanical stress. Consult the datasheet for specific vibration-related specifications.
  • Start by verifying the device's pinout and connections, then check the power supply and signal integrity. Use oscilloscopes or logic analyzers to debug signal issues. If problems persist, consult the datasheet and application notes or contact Micro Commercial Components' technical support.

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HSM24B-TP Overview

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