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HSMS-2850-TR1G - Avago Technologies

Description: BROADCOM LIMITED - HSMS-2850-TR1G - DIODE, RF, SCHOTTKY, REEL 3K

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PCB Footprints
HSMS-2850-TR1G - Avago Technologies PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - Outline 23
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HSMS-2850-TR1G Details

  • Manufacturer Part Number:

    HSMS-2850-TR1G

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    R-PDSO-G3

  • Pin Count:

    3

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.60

  • Manufacturer:

    Avago Technologies

  • YTEOL:

    0

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    MIXER DIODE

  • Frequency Band:

    L BAND

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Frequency-Max:

    4 GHz

  • Operating Frequency-Min:

    0.915 GHz

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Type of Schottky Barrier:

    ZERO BARRIER

HSMS-2850-TR1G Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. The device should be placed near the edge of the board to minimize signal reflections. A 50-ohm microstrip transmission line should be used for the RF signal path.
  • Ensure good thermal conductivity by using a heat sink or thermal pad on the device. Keep the device away from heat sources and ensure good airflow. Operate the device within the recommended temperature range (-40°C to 125°C).
  • Use a 10uF capacitor in parallel with a 100nF capacitor, both connected between the VCC pin and the ground plane. Place the capacitors as close to the device as possible.
  • Use a spectrum analyzer to check the output spectrum for spurious emissions. Verify the input signal level and frequency. Check the device's operating temperature and ensure proper thermal management. Consult the datasheet and application notes for troubleshooting guides.
  • Yes, but ensure that the devices are properly matched and biased. Use a common-mode choke or a balun to combine the outputs. Consult the datasheet and application notes for specific guidance.

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HSMS-2850-TR1G Overview

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