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HSP062-2M6 - STMicroelectronics

Description: STMicroelectronics HSP062-2M6 Dual ESD Protection Array, 6-Pin μQFN

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HSP062-2M6 - STMicroelectronics - PCB symbol
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PCB Footprints
HSP062-2M6 - STMicroelectronics PCB footprint - Small Outline No-lead - Small Outline No-lead - Micro QFN 1.45x1.00 6L dimensions
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HSP062-2M6 - STMicroelectronics - 3D model - Small Outline No-lead - Micro QFN 1.45x1.00 6L dimensions
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HSP062-2M6 Details

  • Manufacturer Part Number:

    HSP062-2M6

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    QFN-6

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Additional Feature:

    ULTRA LOW CAPACITANCE

  • Breakdown Voltage-Min:

    6 V

  • Clamping Voltage-Max:

    18 V

  • Configuration:

    SINGLE, 2 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-N6

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Reference Standard:

    IEC-61000-4-2; MIL-STD-883G

  • Rep Pk Reverse Voltage-Max:

    3 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    3 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

HSP062-2M6 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the package can help to dissipate heat efficiently. The datasheet provides a recommended PCB footprint, but a more detailed layout guide can be found in STMicroelectronics' application notes.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended derating curves for the device. Additionally, consider using a heat sink, thermal interface material, and ensuring good airflow around the device. It's also crucial to monitor the device's junction temperature and adjust the operating conditions accordingly.
  • The HSP062-2M6 is a sensitive device and requires proper ESD protection during handling and assembly. It's recommended to follow standard ESD precautions, such as using an ESD wrist strap, ESD-safe work surfaces, and antistatic packaging. The device should be handled by the body only, and not by the leads.
  • Yes, the HSP062-2M6 is suitable for high-reliability and automotive applications. However, it's essential to follow the recommended qualification and testing procedures outlined in the AEC-Q101 standard for automotive applications. Additionally, ensure that the device is properly derated and operated within its recommended specifications.
  • The HSP062-2M6 requires a controlled soldering process to prevent damage. It's recommended to follow the soldering guidelines outlined in the datasheet, including the use of a soldering iron with a temperature-controlled tip, and a solder with a melting point below 220°C. Additionally, ensure that the device is properly cleaned and dried before assembly.

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HSP062-2M6 Overview

Use the download button to access the HSP062-2M6 schematic symbol, PCB footprint, and 3D model.
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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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