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HSP50216KIZ - Renesas Electronics

Description: The HSP50216 Quad Programmable Digital Downconverter (QPDC) is designed for high dynamic range applications such as cellular basestations where multiple channel processing is required in a small physical space. The QPDC combines into a single package, a set of four channels which include: digital mixers, a quadrature carrier NCO, digital filters, a resampling filter, a Cartesian-to-polar coordinate converter and an AGC loop. The HSP50216 accepts four channels of 16-bit real digitized IF samples which are mi

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Symbol
HSP50216KIZ - Renesas Electronics - PCB symbol
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PCB Footprints
HSP50216KIZ - Renesas Electronics PCB footprint - BGA - BGA - V196.12x12
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3D Models
HSP50216KIZ - Renesas Electronics - 3D model - BGA - V196.12x12
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HSP50216KIZ Details

  • Manufacturer Part Number:

    HSP50216KIZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    FBGA

  • Package Description:

    BGA-196

  • Pin Count:

    196

  • Manufacturer Package Code:

    V196.12X12

  • ECCN Code:

    EAR99

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • JESD-30 Code:

    S-PBGA-B196

  • JESD-609 Code:

    e1

  • Length:

    12 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    196

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.5 mm

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    BASEBAND CIRCUIT

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    12 mm

HSP50216KIZ Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current limits, and that the PCB is designed to minimize thermal gradients. Also, consider using thermal protection circuits or thermal sensors to monitor temperature.
  • Use 0.1uF to 1uF ceramic capacitors placed as close as possible to the power pins, with a maximum distance of 1cm. Additional bulk capacitors (10uF to 100uF) can be placed further away from the device.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input/output lines, and ensure that the PCB is designed with ESD protection in mind, including the use of ESD-resistant components and connectors.
  • The internal voltage regulator can be configured using the VREG_CTRL register. A typical setting is to enable the regulator and set the output voltage to 1.2V or 1.8V, depending on the application requirements.

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HSP50216KIZ Overview

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