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HTRC11001T/03EE - NXP

Description: HITAG reader chip

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HTRC11001T/03EE - NXP PCB footprint - Small Outline Packages - Small Outline Packages - SO14: plastic small outline package; 14 leads; body width 3.9 mm
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HTRC11001T/03EE - NXP  - 3D model - Small Outline Packages - SO14: plastic small outline package; 14 leads; body width 3.9 mm
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for HTRC11001T/03EE
  • Part Number HTRC11001T/03EE
  • Manufacturer NXP
  • Pin Count 14
  • Part Category Integrated Circuit
  • Package Category Small Outline Packages
  • Footprint Name Small Outline Packages - SO14: plastic small outline package; 14 leads; body width 3.9 mm
  • Released Date Nov 20, 2021
  • Last Modified Date Mar 7, 2023 4:10 PM UTC
  • Pinout / Pin List Click Here (Member Only)

HTRC11001T/03EE Details

  • Manufacturer Part Number:

    HTRC11001T/03EE

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14

  • Pin Count:

    14

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    NXP Semiconductors

  • Additional Feature:

    RFID Card Reader

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Length:

    8.65 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    0.01 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    TELECOM CIRCUIT

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

HTRC11001T/03EE Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout in the application note AN11555, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The HTRC11001T/03EE is a flexible device that can be configured for different frequency bands using external components and programming. NXP provides a configuration guide in the application note AN11556, which includes examples for popular frequency bands such as 868 MHz, 915 MHz, and 2.4 GHz.
  • The maximum transmit power of the HTRC11001T/03EE is +20 dBm (100 mW), but this can be limited by the regulatory requirements of the target region and the specific application. It's essential to check the relevant regulations and ensure that the device is operated within the allowed power limits.
  • NXP provides a regulatory guide in the application note AN11557, which includes information on the regulatory requirements for different regions, such as FCC (USA), ETSI (Europe), and TELEC (Japan). It's essential to check the relevant regulations and ensure that the device is operated within the allowed parameters.
  • The operating temperature range of the HTRC11001T/03EE is -40°C to +85°C, but this can be extended to -40°C to +105°C for some applications. It's essential to check the datasheet and application notes for specific temperature range limitations and recommendations.

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HTRC11001T/03EE Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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