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HUFA76429D3ST-F085 - onsemi

Description: Last Shipments - Discrete MOSFETs

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HUFA76429D3ST-F085 - onsemi PCB footprint - Other - Other - HUFA76429D3ST-F085-1
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HUFA76429D3ST-F085 Details

  • Manufacturer Part Number:

    HUFA76429D3ST-F085

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-252 3L (DPAK)

  • Package Description:

    ROHS COMPLIANT PACKAGE-3

  • Manufacturer Package Code:

    369AS

  • Reach Compliance Code:

    Not Compliant

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    ULTRA-LOW RESISTANCE

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    20 A

  • Drain-source On Resistance-Max:

    0.029 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-252AA

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    110 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

HUFA76429D3ST-F085 Frequently Asked Questions (FAQs)

  • A symmetrical layout with thermal vias and a large copper area for heat dissipation is recommended. Ensure the module is placed near a heat sink or a metal plate for efficient heat transfer.
  • Implement a proper cooling system, ensure good airflow, and consider derating the module's current rating according to the temperature derating curve in the datasheet.
  • Use a soldering temperature of 260°C (500°F) with a dwell time of 10-15 seconds. Ensure the module is soldered to a PCB with a solder mask to prevent solder bridging.
  • Yes, but ensure the modules are matched in terms of voltage drop and current rating. Implement a current sharing scheme, such as a master-slave configuration, to ensure equal current distribution.
  • Implement a surge protection device (SPD) and a fuse or a current limiter to protect the module from overvoltage and overcurrent conditions. Consider using a varistor or a TVS diode for additional protection.

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HUFA76429D3ST-F085 Overview

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Part Image HUFA76429D3ST_F085 onsemi

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