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HV5530PJ-G - Microchip

Description: Serial to Parallel Logic Converters 300V 32Ch Open D Out

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HV5530PJ-G - Microchip - PCB symbol
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HV5530PJ-G - Microchip PCB footprint - Plastic Leaded Chip Carrier - Plastic Leaded Chip Carrier - 44J - PLCC
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HV5530PJ-G - Microchip - 3D model - Plastic Leaded Chip Carrier - 44J - PLCC
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HV5530PJ-G Details

  • Manufacturer Part Number:

    HV5530PJ-G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    0.653 X 0.653 INCH, 0.180 INCH HEIGHT, 1.27 MM PITCH, GREEN, PLASTIC, LCC-44

  • Pin Count:

    44

  • Manufacturer Package Code:

    PLCC-44

  • Country Of Origin:

    Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    3

  • Data Input Mode:

    SERIAL

  • Interface IC Type:

    EL DISPLAY DRIVER

  • JESD-30 Code:

    S-PQCC-J44

  • JESD-609 Code:

    e3

  • Length:

    16.5862 mm

  • Moisture Sensitivity Level:

    3

  • Multiplexed Display Capability:

    NO

  • Number of Functions:

    1

  • Number of Segments:

    32

  • Number of Terminals:

    44

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QCCJ

  • Package Equivalence Code:

    LDCC44,.7SQ

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    245

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    4.572 mm

  • Supply Current-Max:

    15 mA

  • Supply Voltage-Max:

    13.2 V

  • Supply Voltage-Min:

    10.8 V

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    J BEND

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    16.5862 mm

  • fmax-Min:

    8 MHz

HV5530PJ-G Frequently Asked Questions (FAQs)

  • Microchip recommends following a star-grounding topology, keeping the analog and digital grounds separate, and using a solid ground plane to minimize noise and EMI. Additionally, keep the high-voltage traces away from low-voltage traces and use shielding if possible.
  • To ensure reliable communication, use a reliable communication protocol such as SPI or I2C, and implement error checking and correction mechanisms. Also, ensure that the microcontroller and HV5530PJ-G are properly synchronized and that the communication clock frequency is within the recommended range.
  • The maximum voltage that can be applied to the HV5530PJ-G's output pins is 100V, but it's recommended to operate within the specified output voltage range of 10V to 90V to ensure reliable operation and to prevent damage to the device.
  • The HV5530PJ-G has built-in overvoltage protection, but it's recommended to add external overvoltage protection circuitry to ensure that the device is protected from voltage transients and spikes. A voltage clamp or a zener diode can be used to limit the voltage to a safe level.
  • The recommended power-up sequence is to first apply the high-voltage supply (VDD) and then the low-voltage supply (VCC). During power-down, the sequence should be reversed, with VCC being turned off first and then VDD. This ensures that the device is properly shut down and prevents any potential damage.

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HV5530PJ-G Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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