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HV7322-V/AGA - Microchip

Description: RF Front End 8-CHANNEL/7-LEVEL, +/-80V, 2A ULTRASOUND TRANSMITTER WITH INTEGRATED DUAL T/R SWITCHES

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HV7322-V/AGA - Microchip PCB footprint - BGA - BGA - HV7322-V/AGA
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HV7322-V/AGA - Microchip  - 3D model - BGA - HV7322-V/AGA
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HV7322-V/AGA Details

  • Manufacturer Part Number:

    HV7322-V/AGA

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TFBGA-206

  • Pin Count:

    206

  • Manufacturer Package Code:

    TFBGA-206

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    26 Weeks

  • Date Of Intro:

    2017-12-12

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    19

  • Consumer IC Type:

    CONSUMER CIRCUIT

  • JESD-30 Code:

    S-PBGA-B206

  • JESD-609 Code:

    e1

  • Length:

    12 mm

  • Number of Functions:

    1

  • Number of Terminals:

    206

  • Operating Temperature-Max:

    85 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA206,18X18,25

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.25 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    BOTTOM

  • Width:

    12 mm

HV7322-V/AGA Frequently Asked Questions (FAQs)

  • Microchip provides a recommended PCB layout in the HV7322-V/AGA evaluation board user's guide, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • To ensure reliable operation in high-temperature environments, it is essential to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and ensuring good airflow around the device. Additionally, the HV7322-V/AGA has a built-in thermal shutdown feature that can be used to prevent damage from overheating.
  • When selecting external components for the HV7322-V/AGA, key considerations include the voltage rating, current handling, and power dissipation of the components. It is also essential to ensure that the components are compatible with the device's operating frequency and can handle the high-voltage stresses present in the application.
  • To troubleshoot issues with the HV7322-V/AGA, it is recommended to follow a systematic approach, starting with a review of the device's operating conditions, power supply, and external component selection. Next, use oscilloscopes and other diagnostic tools to monitor the device's internal signals and identify any anomalies. Finally, consult the device's datasheet and application notes for guidance on troubleshooting specific issues.
  • When using the HV7322-V/AGA in a non-isolated topology, it is essential to ensure that the device is properly grounded and that all safety precautions are taken to prevent electrical shock. This includes following proper safety guidelines, using protective equipment, and ensuring that the device is installed and operated in accordance with local safety regulations.

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HV7322-V/AGA Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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