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HV816K6-G - Microchip

Description: Display Drivers & Controllers HI VOLTAGE DIMMABLE EL LAMP DRIVER

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PCB Footprints
HV816K6-G - Microchip PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 16-Lead QFN Package outline (K6)
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3D Models
HV816K6-G - Microchip  - 3D model - Quad Flat No-Lead - 16-Lead QFN Package outline (K6)
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HV816K6-G Details

  • Manufacturer Part Number:

    HV816K6-G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    16

  • Manufacturer Package Code:

    VQFN-16

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    13

  • Interface IC Type:

    EL DISPLAY DRIVER

  • JESD-30 Code:

    S-XQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    1

  • Multiplexed Display Capability:

    NO

  • Number of Functions:

    1

  • Number of Segments:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Polarity:

    TRUE

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.16SQ,25

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    3 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    4 mm

HV816K6-G Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to use a 4-layer PCB with a solid ground plane, and to place thermal vias under the IC to dissipate heat efficiently.
  • To ensure reliable communication, use differential signaling, add capacitors to filter out noise, and consider using isolation techniques such as optocouplers or digital isolators.
  • Operating the HV816K6-G at high temperatures can reduce its lifespan and affect its performance. Ensure proper heat sinking, and consider derating the device's specifications according to the datasheet.
  • No, the HV816K6-G is not designed for high-voltage applications above 600V. Exceeding the recommended voltage rating can damage the device.
  • Use a logic analyzer or oscilloscope to monitor the device's inputs and outputs, and check for proper power supply, decoupling, and signal integrity. Consult the datasheet and application notes for troubleshooting guidelines.

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HV816K6-G Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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