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HV850MG-G - Microchip

Description: Display Drivers & Controllers HVCMOS Inductorless

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HV850MG-G - Microchip - PCB symbol
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HV850MG-G Details

  • Manufacturer Part Number:

    HV850MG-G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    8

  • Manufacturer Package Code:

    MSOP-8

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Interface IC Type:

    EL DISPLAY DRIVER

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Multiplexed Display Capability:

    NO

  • Number of Functions:

    1

  • Number of Segments:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -25 °C

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    16 mA

  • Supply Voltage-Max:

    4.2 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    3 mm

HV850MG-G Frequently Asked Questions (FAQs)

  • A good PCB layout for the HV850MG-G involves keeping the high-voltage traces short and away from sensitive analog signals. Use a solid ground plane and decouple the device with a 10uF capacitor. Refer to Microchip's application notes for more detailed guidelines.
  • To ensure reliable operation in high-temperature environments, ensure proper heat sinking, and follow the recommended thermal management guidelines in the datasheet. Also, consider using a thermistor or thermocouple to monitor the device temperature and implement thermal shutdown or warning mechanisms if necessary.
  • To ensure EMI and EMC compliance, use a shielded enclosure, keep high-voltage traces short, and use a common-mode choke or ferrite bead to filter high-frequency noise. Also, follow the recommended layout and grounding guidelines in the datasheet.
  • To troubleshoot issues with the HV850MG-G, start by checking the input voltage, current, and temperature. Verify that the device is properly configured and that the PCB layout meets the recommended guidelines. Use an oscilloscope to analyze the voltage and current waveforms, and consult Microchip's application notes and technical support resources for further assistance.
  • When using the HV850MG-G in a high-reliability or safety-critical application, ensure that you follow the recommended design and testing guidelines in the datasheet and relevant industry standards. Implement redundant systems, error detection, and correction mechanisms to ensure fault tolerance and minimize the risk of failure.

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HV850MG-G Overview

Use the download button to access the HV850MG-G schematic symbol, PCB footprint, and 3D model.
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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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