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ICE1HS01G-1 - Infineon

Description: AC/DC Converters Half-Bridge Res Cntlr 18V 600 kHz

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Symbol
ICE1HS01G-1 - Infineon - PCB symbol
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PCB Footprints
ICE1HS01G-1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-DSO 8+
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3D Models
ICE1HS01G-1 - Infineon - 3D model - Small Outline Packages - PG-DSO 8+
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ICE1HS01G-1 Details

  • Manufacturer Part Number:

    ICE1HS01G-1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • Additional Feature:

    ALSO HAS PFM CONTROL TECHNIQUE

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Technique:

    RESONANT CONTROL

  • Input Voltage-Max:

    18 V

  • Input Voltage-Min:

    10.2 V

  • Input Voltage-Nom:

    15 V

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -25 °C

  • Output Current-Max:

    1.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Switching Frequency-Max:

    609 kHz

  • Temperature Grade:

    OTHER

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

ICE1HS01G-1 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or a heat sink to ensure good heat dissipation.
  • Ensure proper thermal design, use a heat sink if necessary, and follow the recommended operating conditions. Monitor the device's junction temperature and adjust the design accordingly.
  • The device has built-in ESD protection, but it's still recommended to follow standard ESD handling precautions during assembly and handling. Use an ESD wrist strap or mat, and ensure the PCB is properly grounded.
  • Yes, but ensure the device is properly secured to the PCB using a suitable adhesive or mechanical fastening method. Vibration testing should be performed to ensure the device's reliability in the specific application.
  • Use a logic analyzer or oscilloscope to monitor the device's input and output signals. Check the power supply, clock signal, and data lines for any anomalies. Consult the datasheet and application notes for troubleshooting guidelines.

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ICE1HS01G-1 Overview

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