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ICE1HS01G - Infineon

Description: ICE1HS01 - LLC Resonant mode Controller

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ICE1HS01G - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-DSO 8
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ICE1HS01G - Infineon  - 3D model - Small Outline Packages - PG-DSO 8
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ICE1HS01G Details

  • Manufacturer Part Number:

    ICE1HS01G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    GREEN, PLASTIC, DSO-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Built-in Protections:

    OVER VOLTAGE; UNDER VOLTAGE

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    5 mm

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -25 °C

  • Output Current Flow Direction:

    SOURCE AND SINK

  • Output Peak Current Limit-Nom:

    1.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.73 mm

  • Supply Voltage-Max:

    18 V

  • Supply Voltage-Min:

    11 V

  • Supply Voltage-Nom:

    15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    OTHER

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    4 mm

ICE1HS01G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to ensure good heat dissipation.
  • Ensure proper thermal design, use a heat sink if necessary, and follow the recommended operating conditions. Monitor the device's junction temperature (TJ) and adjust the design accordingly.
  • The maximum allowed voltage on the VIN pin is 5.5V. Exceeding this voltage may damage the device.
  • Yes, the ICE1HS01G is designed for high-reliability applications. However, ensure that the system is designed with redundancy and fault-tolerance in mind to minimize downtime.
  • Use a logic analyzer or oscilloscope to monitor the device's signals. Check the power supply, clock, and data lines for errors. Consult the datasheet and application notes for troubleshooting guidelines.

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ICE1HS01G Overview

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