ICE2A180ZXKLA1 footprint, schematic symbol and 3D model by Infineon

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PCB Footprints

ICE2A180ZXKLA1 - Infineon PCB footprint - Other - Other - PG-DIP-7-1

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Part Number ICE2A180ZXKLA1
Manufacturer Infineon
Pin Count 7
Part Category Integrated Circuit
Package Category Other
Footprint Name Other - PG-DIP-7-1
Released Date Dec 12, 2021
Last Modified Date Mar 7, 2023 4:10 PM UTC
Pinout / Pin List Click Here (Member Only)

ICE2A180ZXKLA1 Details

Manufacturer Part Number:
ICE2A180ZXKLA1
Pbfree Code:
Yes
Rohs Code:
Yes
Part Life Cycle Code:
Obsolete
Part Package Code:
DIP
Package Description:
GREEN, PLASTIC, DIP-7
Pin Count:
7
ECCN Code:
EAR99
HTS Code:
8542.39.00.60
Factory Lead Time:
13 Weeks
Manufacturer:
Infineon Technologies AG
YTEOL:
0
Analog IC - Other Type:
SWITCHING REGULATOR
Control Mode:
CURRENT-MODE
Control Technique:
PULSE WIDTH MODULATION
Input Voltage-Max:
21 V
Input Voltage-Min:
8.5 V
Input Voltage-Nom:
15 V
JESD-30 Code:
R-PDIP-T7
JESD-609 Code:
e3
Length:
9.52 mm
Number of Functions:
1
Number of Terminals:
7
Operating Temperature-Max:
125 °C
Operating Temperature-Min:
-25 °C
Output Current-Max:
1 A
Package Body Material:
PLASTIC/EPOXY
Package Code:
DIP
Package Shape:
RECTANGULAR
Package Style:
IN-LINE
Qualification Status:
Not Qualified
Seated Height-Max:
4.37 mm
Surface Mount:
NO
Switcher Configuration:
SINGLE
Switching Frequency-Max:
107 kHz
Temperature Grade:
OTHER
Terminal Finish:
Tin (Sn)
Terminal Form:
THROUGH-HOLE
Terminal Pitch:
2.54 mm
Terminal Position:
DUAL
Width:
7.62 mm

ICE2A180ZXKLA1 Frequently Asked Questions (FAQs)

A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a heat sink or a thermal pad to dissipate heat efficiently.
Ensure that the device is operated within the recommended voltage and current ratings, and that the PCB is designed to minimize thermal resistance. Also, consider using thermal management techniques such as heat sinks or thermal interfaces.
The critical timing parameters include the switching frequency, dead time, and minimum on-time. These parameters should be carefully selected to ensure reliable operation and minimize losses.
Optimize the gate drive circuit by selecting a suitable gate resistor value, ensuring a fast rise and fall time, and minimizing the gate drive voltage to reduce power losses.
Key considerations for EMI filtering and shielding include using a common-mode choke, selecting suitable capacitors and resistors, and ensuring proper PCB layout and shielding to minimize electromagnetic interference.

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ICE2A180ZXKLA1 Overview

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