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ICE3AR2280JZXKLA1 - Infineon

Description: Converter Offline Flyback Topology 100kHz PG-DIP-7-1 17 V 75% 100kHz -40°C ~ 150°C (TJ)

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ICE3AR2280JZXKLA1 - Infineon PCB footprint - Other - Other - PG-DIP-7_2025-2.2
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ICE3AR2280JZXKLA1 - Infineon  - 3D model - Other - PG-DIP-7_2025-2.2
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ICE3AR2280JZXKLA1 Details

  • Manufacturer Part Number:

    ICE3AR2280JZXKLA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Package Description:

    GREEN, PLASTIC, DIP-7

  • Pin Count:

    7

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    5

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT/VOLTAGE-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    25 V

  • Input Voltage-Min:

    11.2 V

  • Input Voltage-Nom:

    17 V

  • JESD-30 Code:

    R-PDIP-T7

  • JESD-609 Code:

    e3

  • Length:

    9.385 mm

  • Number of Functions:

    1

  • Number of Terminals:

    7

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP7/8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.8 mm

  • Surface Mount:

    NO

  • Switcher Configuration:

    SINGLE

  • Switching Frequency-Max:

    113 kHz

  • Technology:

    BICMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

ICE3AR2280JZXKLA1 Frequently Asked Questions (FAQs)

  • Infineon recommends a 2-layer or 4-layer PCB with a solid ground plane and a thermal relief pattern under the device to ensure optimal thermal performance.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout guidelines. Also, consider using a thermistor or thermal sensor to monitor the device temperature.
  • A 10uF to 22uF X7R or X5R ceramic capacitor is recommended for the input capacitor, depending on the specific application requirements and input voltage ripple.
  • Check the OCP threshold setting, ensure proper sensing resistor selection, and verify that the OCP pin is properly connected. Also, check for any PCB layout issues or noise coupling that may trigger the OCP.
  • A 10uF to 47uF X7R or X5R ceramic capacitor is recommended for the output capacitor, depending on the specific application requirements and output voltage ripple.

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ICE3AR2280JZXKLA1 Overview

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