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ICE3B0565 - Infineon

Description: IC OFFLINE SWITCH FLYBACK 8DIP

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PCB Footprints
ICE3B0565 - Infineon PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - PG-DIP-8
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3D Models
ICE3B0565 - Infineon  - 3D model - Dual-In-Line Packages - PG-DIP-8
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ICE3B0565 Details

  • Manufacturer Part Number:

    ICE3B0565

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DIP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    21 V

  • Input Voltage-Min:

    9 V

  • Input Voltage-Nom:

    15 V

  • JESD-30 Code:

    R-PDIP-T8

  • Length:

    9.52 mm

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.37 mm

  • Surface Mount:

    NO

  • Switcher Configuration:

    SINGLE

  • Switching Frequency-Max:

    67 kHz

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

ICE3B0565 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a heat sink or a thermal pad to dissipate heat efficiently.
  • Ensure proper thermal design, use a heat sink or thermal pad, and follow the recommended PCB layout. Also, consider derating the device's power handling at high temperatures (above 85°C).
  • A low-ESR ceramic capacitor (e.g., X5R or X7R) with a value between 4.7 μF to 10 μF is recommended. The capacitor should be placed close to the device's input pins.
  • Use a shielded layout, keep sensitive components away from the ICE3B0565, and use a common-mode choke or ferrite bead on the input lines. Also, ensure proper grounding and decoupling.
  • The maximum allowed voltage drop across the device is 1.5 V. Exceeding this may affect the device's reliability and performance.

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ICE3B0565 Overview

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