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ICE3PCS03G - Infineon

Description: Infineon ICE3PCS03G, Power Factor Controller, 250 kHz, Maximum of 25 V, 8-Pin DSO

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PCB Footprints
ICE3PCS03G - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-DSO-8_2023
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3D Models
ICE3PCS03G - Infineon  - 3D model - Small Outline Packages - PG-DSO-8_2023
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ICE3PCS03G Details

  • Manufacturer Part Number:

    ICE3PCS03G

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SOP-8

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    7

  • Analog IC - Other Type:

    POWER FACTOR CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    25 V

  • Input Voltage-Min:

    11.9 V

  • Input Voltage-Nom:

    18 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -25 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Nom (Vsup):

    18 V

  • Surface Mount:

    YES

  • Switcher Configuration:

    BOOST

  • Switching Frequency-Max:

    250 kHz

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    4 mm

ICE3PCS03G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a heat sink or a thermal pad to ensure good thermal conduction.
  • Ensure proper thermal design, use a heat sink or thermal pad, and follow the recommended PCB layout. Also, consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
  • The maximum allowed voltage on the VIN pin is 28V, but it's recommended to keep it below 24V for reliable operation and to prevent damage to the internal voltage regulator.
  • Optimize the device configuration by selecting the correct switching frequency, adjusting the output voltage, and using the built-in power saving modes (e.g., pulse-skipping mode) to minimize power losses.
  • Use X7R or X5R ceramic capacitors with a voltage rating of 10V or higher for the input capacitor (CIN) and a voltage rating of 5V or higher for the output capacitor (COUT). The recommended capacitance values are 10uF to 22uF for CIN and 10uF to 47uF for COUT.

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ICE3PCS03G Overview

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