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ICE3PCS03GXUMA1 - Infineon

Description: IC PFC CTRLR CCM 250KHZ 8DSO

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PCB Footprints
ICE3PCS03GXUMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-DSO-8-2022
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3D Models
ICE3PCS03GXUMA1 - Infineon  - 3D model - Small Outline Packages - PG-DSO-8-2022
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ICE3PCS03GXUMA1 Details

  • Manufacturer Part Number:

    ICE3PCS03GXUMA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    GREEN, PLASTIC, SOP-8

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    7

  • Analog IC - Other Type:

    POWER FACTOR CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    25 V

  • Input Voltage-Min:

    11.9 V

  • Input Voltage-Nom:

    18 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -25 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BOOST

  • Switching Frequency-Max:

    250 kHz

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    4 mm

ICE3PCS03GXUMA1 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/mK, and consider using a heat sink with a thermal resistance of less than 10°C/W.
  • A 10uF to 22uF X7R or X5R ceramic capacitor with a voltage rating of at least 25V is recommended for input decoupling.
  • Use a shielded inductor, keep the layout compact, and use a common-mode choke or EMI filter to reduce emissions. Ensure proper grounding and decoupling of the device.
  • The maximum allowed voltage drop across the device is 0.5V. Exceeding this may affect device reliability and performance.

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ICE3PCS03GXUMA1 Overview

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