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ICE3RBR4765JGXUMA1 - Infineon

Description: AC/DC Converters AC/DC COOLSET

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ICE3RBR4765JGXUMA1 - Infineon PCB footprint - Other - Other - ICE3RBR4765JGXUMA1-4
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ICE3RBR4765JGXUMA1 Details

  • Manufacturer Part Number:

    ICE3RBR4765JGXUMA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DSO-12

  • Country Of Origin:

    Mainland China, Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    25 V

  • Input Voltage-Min:

    11.2 V

  • Input Voltage-Nom:

    18 V

  • JESD-30 Code:

    R-PDSO-G12

  • JESD-609 Code:

    e3

  • Length:

    9.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    12

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    3.4 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    SINGLE

  • Switching Frequency-Max:

    67.6 kHz

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

ICE3RBR4765JGXUMA1 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to ensure efficient heat dissipation.
  • Ensure proper thermal management, use a heat sink or thermal pad, and follow the recommended PCB layout. Also, consider using a thermistor or thermal sensor to monitor the device temperature.
  • Use X7R or X5R ceramic capacitors with a voltage rating of 25V or higher. The input capacitor should be 10uF to 22uF, and the output capacitor should be 10uF to 47uF, depending on the specific application requirements.
  • Use the shutdown pin to disable the device when not in use. Also, ensure that the input voltage is as low as possible while still meeting the device's minimum input voltage requirement.
  • Use a common-mode choke and a differential-mode filter capacitor to reduce EMI emissions. The specific component values will depend on the application and the desired level of EMI suppression.

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ICE3RBR4765JGXUMA1 Overview

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