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ICE40LP1K-CM36TR1K - Lattice Semiconductor

Description: FPGA iCE40 LP Family 1280 Cells 40nm Technology 1.2V 36-Pin UCBGA T/R

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PCB Footprints
ICE40LP1K-CM36TR1K - Lattice Semiconductor PCB footprint - BGA - BGA - 36-Ball ucBGA
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3D Models
ICE40LP1K-CM36TR1K - Lattice Semiconductor  - 3D model - BGA - 36-Ball ucBGA
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ICE40LP1K-CM36TR1K Details

  • Manufacturer Part Number:

    ICE40LP1K-CM36TR1K

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    Lattice Semiconductor Corporation

  • YTEOL:

    8

  • Clock Frequency-Max:

    179.21 MHz

  • Combinatorial Delay of a CLB-Max:

    9.36 ns

  • JESD-30 Code:

    S-PBGA-B36

  • JESD-609 Code:

    e1

  • Length:

    2.5 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    160

  • Number of Inputs:

    25

  • Number of Logic Cells:

    1280

  • Number of Outputs:

    25

  • Number of Terminals:

    36

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    160 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA36,6X6,16

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    0.91 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Width:

    2.5 mm

ICE40LP1K-CM36TR1K Frequently Asked Questions (FAQs)

  • Lattice provides a PCB design guide and layout recommendations in their documentation, including guidelines for signal integrity, power distribution, and thermal management. It's essential to follow these guidelines to ensure reliable operation and minimize signal degradation.
  • To optimize power consumption, use the Lattice Diamond software to analyze and optimize the design for power. Additionally, consider using the FPGA's built-in power management features, such as dynamic voltage and frequency scaling, and implement power gating and clock gating techniques in the design.
  • The internal oscillator has a limited frequency range and accuracy. If your design requires a higher frequency or more precise clocking, it's recommended to use an external clock source. Additionally, if you need to synchronize multiple FPGAs or devices, an external clock source is preferred.
  • Use the Lattice Diamond software to generate a reliable configuration bitstream, and follow the recommended programming procedures. Ensure that the FPGA is properly powered and clocked during configuration, and use a reliable programming interface, such as JTAG or SPI.
  • The FPGA has a maximum junction temperature rating of 85°C. Ensure good airflow around the device, and consider using a heat sink or thermal interface material if the device will be operating in a high-temperature environment. Monitor the device temperature using the built-in thermal sensor and take corrective action if necessary.

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ICE40LP1K-CM36TR1K Overview

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