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iCE40LP1K-CM81 - Lattice Semiconductor

Description: Lattice FPGA iCE40LP1K-CM81, iCE40 LP 1280 Cells, 64kbit, 160 Blocks, 81-Pin UCBGA

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iCE40LP1K-CM81 - Lattice Semiconductor PCB footprint - BGA - BGA - 81-Ball ucBGA Package
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iCE40LP1K-CM81 - Lattice Semiconductor  - 3D model - BGA - 81-Ball ucBGA Package
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iCE40LP1K-CM81 Details

  • Manufacturer Part Number:

    ICE40LP1K-CM81

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    Lattice Semiconductor Corporation

  • YTEOL:

    8

  • Clock Frequency-Max:

    133 MHz

  • Combinatorial Delay of a CLB-Max:

    9.36 ns

  • JESD-30 Code:

    S-PBGA-B81

  • JESD-609 Code:

    e1

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    160

  • Number of Inputs:

    63

  • Number of Logic Cells:

    1280

  • Number of Outputs:

    63

  • Number of Terminals:

    81

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    160 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA81,9X9,16

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

iCE40LP1K-CM81 Frequently Asked Questions (FAQs)

  • Lattice provides a PCB design guide and layout recommendations in their documentation. It's essential to follow these guidelines to ensure signal integrity and minimize noise. Additionally, using a 4-layer PCB with a solid ground plane and a separate power plane is recommended.
  • To optimize power consumption, use the Lattice Diamond software to analyze and optimize the design for power. Additionally, consider using the FPGA's built-in power management features, such as dynamic voltage and frequency scaling, and implement power gating and clock gating in your design.
  • Implement a secure boot process by using a secure boot loader, such as Lattice's Secure Boot, and ensure that the boot process is encrypted and authenticated. Also, use a secure configuration storage, such as a secure flash memory, and implement access controls and encryption for sensitive data.
  • To ensure signal integrity and minimize noise, follow Lattice's PCB design guidelines, use a solid ground plane, and implement proper signal termination and filtering. Additionally, use differential signaling and consider using a noise-reducing technique, such as spread spectrum clocking.
  • The built-in PLLs have limitations on frequency range, jitter, and phase noise. Consider using external clock sources or PLLs for high-frequency or high-precision clocking requirements. Also, be aware of the PLL's power consumption and noise sensitivity.

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iCE40LP1K-CM81 Overview

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Part Image ICE40LP1K-CM81TR Lattice Semiconductor Corporation

Field Programmable Gate Array, 160 CLBS, 1280-Cell, CMOS, PBGA81