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ICL3237ECAZ - Renesas Electronics

Description: The ICL3237E contains 3. 0V to 5. 5V powered RS-232 transmitters/receivers that meet ElA/TIA-232 and V. 28/V. 24 specifications, even at VCC = 3. 0V. It provides ±15kV ESD protection (IEC61000-4-2 Air Gap and Human Body Model) on transmitter outputs and receiver inputs (RS-232 pins). Targeted applications are cell phones, PDAs, Palmtops, and notebook and laptop computers where the low operational power and even lower standby power consumption is critical. Efficient on-chip charge pumps coupled with the manu

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PCB Footprints
ICL3237ECAZ - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M28.209
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ICL3237ECAZ - Renesas Electronics  - 3D model - Small Outline Packages - M28.209
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ICL3237ECAZ Details

  • Manufacturer Part Number:

    ICL3237ECAZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SSOP

  • Package Description:

    SSOP-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    M28.209

  • Country Of Origin:

    Malaysia, Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7

  • Differential Output:

    NO

  • Driver Number of Bits:

    5

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-232; TIA-232; V.24; V.28

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    10.2 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    3

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP28,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Receiver Number of Bits:

    3

  • Seated Height-Max:

    2 mm

  • Supply Current-Max:

    1 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3.15 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5.3 mm

ICL3237ECAZ Frequently Asked Questions (FAQs)

  • A good PCB layout for the ICL3237ECAZ involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the traces connecting the device to the power supply and load. Additionally, it's recommended to use a 0.1uF decoupling capacitor between the VCC and GND pins.
  • To ensure proper power-on and power-off sequencing, it's recommended to power on the ICL3237ECAZ after the power supply has stabilized, and to power off the device before the power supply is turned off. Additionally, a soft-start circuit can be used to limit the inrush current during power-on.
  • The maximum cable length supported by the ICL3237ECAZ depends on the specific application and the type of cable used. However, as a general guideline, the device can support cable lengths of up to 100 meters for RS-232 and 400 meters for RS-485, assuming a good quality cable with proper termination.
  • To troubleshoot communication issues with the ICL3237ECAZ, first check the power supply and ground connections, then verify the transmit and receive pin connections. Use a logic analyzer or oscilloscope to check the signal integrity and timing. Also, ensure that the baud rate and data format are correctly configured.
  • Yes, the ICL3237ECAZ can be used in a multi-drop configuration, but it's essential to ensure that the total bus capacitance does not exceed the recommended maximum value. Additionally, the device's slew rate and output impedance should be considered when designing the multi-drop configuration.

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