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IDD03SG60CXTMA2 - Infineon

Description: Schottky Diodes & Rectifiers SIC DIODES

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PCB Footprints
IDD03SG60CXTMA2 - Infineon PCB footprint - Other - Other - PG-TO252-3_2022-2
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3D Models
IDD03SG60CXTMA2 - Infineon  - 3D model - Other - PG-TO252-3_2022-2
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IDD03SG60CXTMA2 Details

  • Manufacturer Part Number:

    IDD03SG60CXTMA2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Country Of Origin:

    Austria, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    3

  • Additional Feature:

    PD-CASE

  • Application:

    FAST RECOVERY

  • Breakdown Voltage-Min:

    600 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON CARBIDE

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    2.3 V

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    11.5 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Power Dissipation-Max:

    38 W

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    15 µA

  • Reverse Test Voltage:

    600 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

IDD03SG60CXTMA2 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the IDD03SG60CXTMA2 is -40°C to 150°C.
  • A recommended PCB layout for optimal thermal performance would be to use a thermal pad on the bottom of the device, connected to a large copper area on the PCB to dissipate heat efficiently.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes the risk of overheating the device.
  • To prevent ESD damage, handle the device in an ESD-protected environment, wear an ESD wrist strap or use an ESD mat, and avoid touching the device's pins or pads.
  • Yes, the IDD03SG60CXTMA2 is suitable for high-reliability applications, as it is designed and manufactured to meet the requirements of the automotive and aerospace industries.

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IDD03SG60CXTMA2 Overview

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