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IDD09E60 - Infineon

Description: Diode 600V 19.3A Switching TO-252 Infineon IDD09E60, SMT Fast Recovery Diode, 600V 19A, 112ns, 3-Pin TO-252

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PCB Footprints
IDD09E60 - Infineon PCB footprint - Other - Other - PG-TO252 -3_ffw
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IDD09E60 - Infineon  - 3D model - Other - PG-TO252 -3_ffw
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IDD09E60 Details

  • Manufacturer Part Number:

    IDD09E60

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-252AA

  • Package Description:

    GREEN, PLASTIC, TO-252, DPAK-3

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Application:

    FAST SOFT RECOVERY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    2 V

  • JEDEC-95 Code:

    TO-252AA

  • JESD-30 Code:

    R-PSSO-G2

  • Non-rep Pk Forward Current-Max:

    40 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    19.3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power Dissipation-Max:

    57.7 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Recovery Time-Max:

    0.075 µs

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

IDD09E60 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for IDD09E60 is -40°C to 150°C, as specified in the datasheet. However, it's essential to note that the device's performance and reliability may degrade at extreme temperatures.
  • To ensure proper cooling, follow the thermal design guidelines provided in the datasheet. This includes using a heat sink with a thermal resistance of ≤ 1.5 K/W, and ensuring good airflow around the device. Additionally, consider using thermal interface materials and following proper PCB design practices.
  • The recommended PCB layout for IDD09E60 involves using a 4-layer PCB with a solid ground plane, and placing the device near the center of the board. Ensure that the power traces are wide and short, and that the decoupling capacitors are placed close to the device. Refer to the datasheet and application notes for more detailed guidelines.
  • To handle the IDD09E60's high current requirements, use a robust power supply design that can provide the necessary current. Ensure that the power traces and vias are capable of handling the high current, and consider using multiple power sources or a high-current connector. Additionally, follow proper PCB design practices to minimize voltage drops and ensure reliable operation.
  • The IDD09E60 has built-in ESD protection, but it's still essential to follow proper ESD handling and protection procedures during assembly and testing. This includes using ESD-safe materials, grounding straps, and following proper handling techniques to prevent damage to the device.

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IDD09E60 Overview

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