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IDH08G65C6XKSA1 - Infineon

Description: INFINEON - IDH08G65C6XKSA1 - SIC SCHOTTKY DIODE, 650V, 20A, TO-220

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Symbol
IDH08G65C6XKSA1 - Infineon - PCB symbol
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PCB Footprints
IDH08G65C6XKSA1 - Infineon PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - PG-TO220-2
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3D Models
IDH08G65C6XKSA1 - Infineon - 3D model - Transistor Outline, Vertical - PG-TO220-2
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IDH08G65C6XKSA1 Details

  • Manufacturer Part Number:

    IDH08G65C6XKSA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    TO-220, 2 PIN

  • Country Of Origin:

    Austria, Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    3

  • Additional Feature:

    PD-CASE

  • Application:

    EFFICIENCY

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.35 V

  • JEDEC-95 Code:

    TO-220AC

  • JESD-30 Code:

    R-PSFM-T2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    37 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    20 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Power Dissipation-Max:

    63 W

  • Rep Pk Reverse Voltage-Max:

    650 V

  • Reverse Current-Max:

    27 µA

  • Reverse Test Voltage:

    420 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

IDH08G65C6XKSA1 Frequently Asked Questions (FAQs)

  • Infineon recommends a 2-layer or 4-layer PCB with a thermal via array under the device to improve heat dissipation. A minimum of 10 thermal vias with a diameter of 0.3 mm is recommended.
  • Ensure proper heat sinking, use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/mK, and follow the recommended PCB layout guidelines. Additionally, consider using a heat sink with a thermal resistance of less than 10 K/W.
  • The maximum allowed voltage on the gate driver output is 15 V, with a maximum transient voltage of 18 V for a duration of less than 100 ns.
  • Use a fuse or a current-sensing resistor to detect overcurrent conditions. For overvoltage protection, use a voltage supervisor or a voltage monitor IC to detect voltage levels above the recommended maximum rating.
  • The recommended gate resistance is between 1 ohm and 10 ohms, depending on the specific application requirements. A lower gate resistance can improve switching speed, but may increase power losses.

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IDH08G65C6XKSA1 Overview

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