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IDH16G65C5XKSA2 - Infineon

Description: DIODE SIL CARB 650V 16A PGTO2201

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PCB Footprints
IDH16G65C5XKSA2 - Infineon PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220-2
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3D Models
IDH16G65C5XKSA2 - Infineon  - 3D model - Transistor Outline, Vertical - TO-220-2
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IDH16G65C5XKSA2 Details

  • Manufacturer Part Number:

    IDH16G65C5XKSA2

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TO-220, 2 PIN

  • Country Of Origin:

    Austria, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    5

  • Additional Feature:

    HIGH RELIABILITY, PD-CASE

  • Application:

    EFFICIENCY

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON CARBIDE

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.7 V

  • JEDEC-95 Code:

    TO-220AC

  • JESD-30 Code:

    R-PSFM-T2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    637 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    16 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Power Dissipation-Max:

    129 W

  • Rep Pk Reverse Voltage-Max:

    650 V

  • Reverse Current-Max:

    200 µA

  • Reverse Test Voltage:

    650 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

IDH16G65C5XKSA2 Frequently Asked Questions (FAQs)

  • The IDH16G65C5XKSA2 can operate from -40°C to 150°C, making it suitable for high-reliability applications.
  • The device has a thermal pad on the bottom, which should be connected to a heat sink or a thermal interface material to ensure proper heat dissipation.
  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. The device's thermal pad should be connected to the ground plane.
  • The device requires a specific power-up sequence to ensure proper operation. The recommended sequence is to power up the VCC pin first, followed by the VGS pin.
  • The device has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures when handling the device to prevent damage.

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IDH16G65C5XKSA2 Overview

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