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IDK02G120C5XTMA1 - Infineon

Description: Schottky Diodes & Rectifiers SIC DISCRETE

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IDK02G120C5XTMA1 - Infineon PCB footprint - Other - Other - PG-TO263-2
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IDK02G120C5XTMA1 Details

  • Manufacturer Part Number:

    IDK02G120C5XTMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TO-263, 2 PIN

  • Country Of Origin:

    Austria, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    7

  • Additional Feature:

    HIGH RELIABILITY, PD-CASE

  • Application:

    EFFICIENCY

  • Breakdown Voltage-Min:

    1200 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON CARBIDE

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.65 V

  • JEDEC-95 Code:

    TO-263AB

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    37 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    11.8 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    75 W

  • Rep Pk Reverse Voltage-Max:

    1200 V

  • Reverse Current-Max:

    18 µA

  • Reverse Test Voltage:

    1200 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

IDK02G120C5XTMA1 Frequently Asked Questions (FAQs)

  • Infineon provides a reference design and layout guidelines in their application notes and evaluation boards. It's essential to follow these guidelines to ensure proper thermal management and minimize parasitic inductances. Additionally, a 2-layer or 4-layer PCB with a solid ground plane and a thermal pad connected to a heat sink is recommended.
  • The gate driver selection depends on the specific application requirements, such as the switching frequency, voltage, and current. Infineon recommends using their EiceDRIVER™ gate driver family, which is specifically designed for their IGBT modules. The EiceDRIVER™ 1EDF5673B, for example, is a suitable option for the IDK02G120C5XTMA1.
  • The IDK02G120C5XTMA1 has built-in overcurrent and overvoltage protection, but it's essential to design the system to prevent these conditions from occurring. The maximum allowed overcurrent is typically 2-3 times the nominal current, and the maximum allowed overvoltage is 10-20% above the nominal voltage. However, it's recommended to consult Infineon's application notes and the module's datasheet for specific guidance.
  • To ensure EMC, it's crucial to follow proper PCB layout and design guidelines, such as keeping the IGBT module and gate driver close together, using a solid ground plane, and minimizing loop areas. Additionally, using shielding, filtering, and proper cable management can help reduce electromagnetic interference (EMI). Infineon provides EMC guidelines in their application notes and datasheets.
  • For high-power applications, a forced air cooling system or a liquid cooling system is recommended. The cooling system should be designed to maintain a junction temperature (Tj) below 125°C. Infineon provides thermal management guidelines and recommends using their thermal interface material (TIM) for optimal heat transfer.

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IDK02G120C5XTMA1 Overview

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