Infineon provides a recommended PCB layout in their application note AN2019-01, which includes guidelines for thermal vias, copper thickness, and component placement to minimize thermal resistance.
To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, use a suitable thermal interface material, and implement a robust cooling system. Additionally, consider using a thermistor or temperature sensor to monitor the device temperature.
While the datasheet specifies the maximum rated voltage, it's essential to consider the voltage transient tolerance. According to Infineon's application note AN2019-02, the IDP18E120 can tolerate voltage transients up to 1.5 times the maximum rated voltage for a duration of 100 ms.
To minimize power loss in the gate drive circuit, use a low-impedance gate driver, optimize the gate resistance, and ensure a low-inductance layout. Additionally, consider using a gate driver with an integrated bootstrap diode to reduce power loss.
Infineon recommends using a human-body model (HBM) ESD protection circuit with a minimum rating of 2 kV. This can be achieved using external ESD protection devices or by implementing an on-chip ESD protection circuit.
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IDP18E120 Overview
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